| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76855
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-535
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02183
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76865 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-535 |
| filingDate |
2019-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90a255708027d631ac195c88409a26a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6811fe45803996354e7f644de23b175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c924eb525f9666ae6e87ff54cbe56d33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a89ae67cd2cf2f9a1c1bdcd5bbd547f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acec069c47db153e089e15aaba0a9322 |
| publicationDate |
2020-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020227313-A1 |
| titleOfInvention |
Forming Barrierless Contact |
| abstract |
Techniques for forming barrierless contacts filled with Co are provided. In one aspect, a method for forming barrierless contacts includes: forming bottom metal contacts in a first ILD; depositing a second ILD on the bottom metal contacts; forming contact vias in the second ILD landing on the bottom metal contacts; selectively forming a liner on a top surface of the second ILD and on the second ILD along sidewalls of the contact vias; filling the contact vias with a metal; and removing an excess of the metal to form the barrierless contacts whereby metal-to-metal contact is present between the barrierless contacts and the bottom metal contacts. A contact structure is also provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022392899-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11776901-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022293515-A1 |
| priorityDate |
2019-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |