| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2839
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2607
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0255 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525 |
| filingDate |
2020-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5cb24b2cfcec8d620b1b9fc4cce3311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6722049098196db4cb2d85be3965786
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89965a3d7981209774823030f3accd7a |
| publicationDate |
2020-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020219868-A1 |
| titleOfInvention |
Esd hard backend structures in nanometer dimension |
| abstract |
Some embodiments relate to a semiconductor device on a substrate. An interconnect structure is disposed over the semiconductor substrate. A first conductive pad is disposed over the interconnect structure. A second conductive pad is disposed over the interconnect structure and spaced apart from the first conductive pad. A third conductive pad is disposed over the interconnect structure and spaced apart from the first and second conductive pads. A first ESD protection element is electrically coupled between the first and second conductive pads. A first device under test (DUT) is electrically coupled between the first and third conductive pads. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11621261-B2 |
| priorityDate |
2015-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |