Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2839 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2601 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5256 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0292 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0251 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-525 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
filingDate |
2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5cb24b2cfcec8d620b1b9fc4cce3311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89965a3d7981209774823030f3accd7a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6722049098196db4cb2d85be3965786 |
publicationDate |
2020-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10629588-B2 |
titleOfInvention |
ESD hard backend structures in nanometer dimension |
abstract |
Some embodiments relate to a semiconductor device on a substrate. An interconnect structure is disposed over the substrate, and a first conductive pad is disposed over the interconnect structure. A second conductive pad is disposed over the interconnect structure and is spaced apart from the first conductive pad. A third conductive pad is disposed over the interconnect structure and is spaced apart from the first and second conductive pads. A fourth conductive pad is disposed over the interconnect structure and is spaced apart from the first, second, and third conductive pads. A first ESD protection element is electrically coupled between the first and second pads; and a second ESD protection element is electrically coupled between the third and fourth pads. A first device under test is electrically coupled between the first and third conductive pads; and a second device under test is electrically coupled between the second and fourth pads. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10957687-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11621261-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020219868-A1 |
priorityDate |
2015-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |