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filingDate 2018-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020098669-A1
titleOfInvention Thermal management solutions for substrates in integrated circuit packages
abstract An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and at least one heat transfer fluid conduit extending through the substrate, wherein the heat transfer fluid conduit is electrically attached to the at least one integrated circuit device. In one embodiment, the at least one heat transfer fluid conduit is a power transfer route for the at least one integrated circuit device.
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