| abstract |
A film forming method for forming a film on a pattern formed on a substrate includes: placing a substrate having a pattern on a pedestal provided in a space configured to perform therein a plasma processing under a reduced pressure environment, an upper electrode configured to supply radio-frequency power being disposed in the space to face the pedestal; adjusting temperature of a main surface of the substrate for each of a plurality of regions on the main surface of the substrate; and after the adjusting, repeating a sequence including a first step of forming a deposition film on the pattern of the substrate and a second step of supplying electric power only to the upper electrode to generate plasma in the space, thereby cleaning the space. |