| abstract |
An epoxy resin composition which is suppressed in curing shrinkage upon being cured to obtain a cured film having low warpage and high adhesion. The epoxy resin composition contains epoxy resin (A), compound (B) represented by formula (1) and nanosilica filler (C). In formula (1), R 1 and R 2 are independently an alkyl group having 1 to 10 carbons or a phenyl group, and X is independently hydrogen or a monovalent organic group, and in one molecule of the compound, at least one of X includes an epoxy group. |