| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c0444efde206a2f829562761e58b7e1e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-686
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-02 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2018-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35783fa40c32ff92f8a550d3f5c5cceb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba5124c44ec6274b01e6609dbe9cbd7e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c33150b50708c2c6fa15c4de1d2595c |
| publicationDate |
2021-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11149118-B2 |
| titleOfInvention |
Insulating film forming composition, insulating film, and semiconductor device provided with insulating film |
| abstract |
The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [R a SiO 3/2 ] (I) and constituent units represented by formula (II) n [R a SiO 2/2 (OR b )] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq. |
| priorityDate |
2017-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |