| abstract |
The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): n n n n n n n n n n wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): n n n n n n n n n n wherein Y is a bond, a C 1-6 alkylene group, etc.; n R 1 is the same or different, and is a C 1-18 alkyl group, etc., n R 2 is the same or different, and is a C 1-18 alkylene group, etc., n R 3 is the same or different, and is a C 1-18 alkyl group, etc., and n n is the same or different, and is an integer of 0 to 3. n The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof. |