| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_103689de83223684861385d7f611b25e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2475-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2421-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-42 |
| filingDate |
2018-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_793944e4a05d735385c649174fe373ee |
| publicationDate |
2019-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-109554148-A |
| titleOfInvention |
One-component heat-curable epoxy adhesive with improved adhesion |
| abstract |
The present invention relates to a one-component thermosetting epoxy resin adhesive comprising a) at least one epoxy resin A having an average of more than one epoxy group per molecule; b) at least one epoxy resin and c) at least one carboxylic acid selected from the group consisting of substituted or unsubstituted succinic acid and substituted or unsubstituted phthalic acid, wherein the epoxy resin adhesive contains 1.7 to 15 mmol of all The at least one carboxylic acid per 100 grams of epoxy resin adhesive, and the epoxy resin adhesive has a viscosity greater than 10,000 Pas at 25°C. The epoxy resin adhesives are particularly characterized by good adhesion to certain metal substrates such as steel and magnesium. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113502032-A |
| priorityDate |
2017-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |