| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-068
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F122-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F122-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2017-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9df0bb15b5de2793fe7a1cca8cd425d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24bb9eaddd8d7761b06b2bfaf397d3c6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_613548198e743d8a31e0f9c1a97a31b9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd0228f8407dee34b162d6780e759a08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c905e4a35e29fa24364c218e70f96d4f |
| publicationDate |
2019-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019056658-A1 |
| titleOfInvention |
Photo-curable and heat-curable resin composition and dry film solder resist |
| abstract |
The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113759663-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11361878-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114545734-A |
| priorityDate |
2016-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |