Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33c922e05f6133b7d72dbb849d77487d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-30 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-07 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-30 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
filingDate |
2018-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9df0bb15b5de2793fe7a1cca8cd425d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24bb9eaddd8d7761b06b2bfaf397d3c6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8465c85ed6bb15aa69d18280fcad4b1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd0228f8407dee34b162d6780e759a08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c905e4a35e29fa24364c218e70f96d4f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_613548198e743d8a31e0f9c1a97a31b9 |
publicationDate |
2022-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11361878-B2 |
titleOfInvention |
Method for manufacturing insulating film and semiconductor package |
abstract |
The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer. |
priorityDate |
2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |