Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b3310ea86f3c492f6c09d7be6592866d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09527 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09936 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-465 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
filingDate |
2018-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a86168405000b4b6ae7da7c860f883a |
publicationDate |
2019-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2019037693-A1 |
titleOfInvention |
Printed circuit board and method of fabricating the same |
abstract |
A printed circuit board in accordance with a disclosed embodiment may include first insulating layer having first via formed therein and second insulating layer laminated on both surfaces of the first insulating layer and having second via formed therein. The second via may connect first circuit formed on the first insulating layer with second circuit formed on the second insulating layer. A diameter of the second via may become greater toward an inside of the printed circuit board. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11252817-B1 |
priorityDate |
2017-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |