| abstract |
A structure of a circuit board and a method for fabricating the same are proposed. A first and a second dielectric layers are formed on a first and a second carrier boards respectively, and a first and a second circuit layers are formed on the first and second dielectric layer respectively. Then, between the first circuit layer of the first carrier board and the second circuit layer of the second carrier board is laminated a third dielectric layer, and thus the first circuit layer is embedded between the first and the third dielectric layers, and the second circuit layer is embedded between the second and the third dielectric layers. The two carrier boards are removed to form a core board with the first and the second circuit layers. Afterwards, a third and a fourth circuit layers are formed on the first and the second dielectric layers respectively. After a plurality of conductive vias are formed between those dielectric layers, the first, second, third and fourth circuit layers can be electrically connected through the conductive vias, thereby forming the circuit board with high density circuit layout. |