http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018327887-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3405 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C1-045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-3414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-564 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 |
| filingDate | 2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d94a35d328d2db0f9fdc225b687cef9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_280df1311ac5d6a7c04862c3932fb7ca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09db49a2c537c8200ebeac87e341359f |
| publicationDate | 2018-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2018327887-A1 |
| titleOfInvention | Refractory metal alloy targets for physical vapor deposition |
| abstract | Refractory metal alloy targets for reducing particles in physical vapor deposition processing and refractory metal-based layer for integrated circuit applications (for example, crystallization barrier layers in non-volatile memory devices) are disclosed herein. An exemplary method for reducing particles in a PVD chamber include positioning a refractory metal alloy target in the PVD chamber, positioning a substrate in the PVD chamber a distance from the refractory metal alloy target, and sputtering material from the refractory metal alloy target to form a refractory metal-based layer over the substrate. The refractory metal alloy target includes a refractory metal (for example, tungsten or molybdenum) alloyed with a body-centered cubic (BCC) metal (for example, niobium, tantalum, vanadium, or a combination thereof). The BCC metal has a Young's modulus lower than a Young's modulus of the refractory metal. |
| priorityDate | 2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.