| abstract |
The present invention provides a pattern forming method which can be suitably applied to grayscale exposure since a deviation of the thickness among production lots is hardly generated, and an actinic ray-sensitive or radiation-sensitive resin composition. The pattern forming method of the present invention is a pattern forming method having a step A of forming a film having a thickness T on a substrate, using an actinic ray-sensitive or radiation-sensitive resin composition including a resin whose solubility in a developer changes by the action of an acid and an acid generator, a step B of exposing the film, and a step C of developing the exposed film using a developer to form a pattern, in which the film formed in the step A satisfies at least one of the following condition 1 or 2. n Condition 1: In a case where the thickness T of the film is 800 nm or more, the value of γ is less than 10,000. n Condition 2: In a case where the thickness T of the film is less than 800 nm, the value of γ is less than 5,000. |