abstract |
The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), n n n n n n n n n n wherein X 1 represents a tetravalent organic group; and R 1 represents a group shown by the following general formula (2), n Y 1 n Rf) k (2)n n wherein the dotted line represents a bond; Y 1 represents an organic group with a valency of k+1; Rf represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms or an aromatic group in which a part or all of hydrogen atoms is/are substituted with a fluorine atom(s); “k” represents 1, 2, or 3; and “n” represents 0 or 1. There can be provided a tetracarboxylic acid diester compound that can give a polyimide precursor polymer soluble in a safe organic solvent widely used as a solvent of a composition, and usable as a base resin of a negative photosensitive resin composition. |