| titleOfInvention |
Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts |
| abstract |
This is to provide a polymer of a polyimide precursor which is soluble in an aqueous alkaline solution, and capable of using a base resin of a positive type and negative type photosensitive resin composition which is capable of forming a fine pattern and obtaining high resolution. Also provided is a positive type and negative type photosensitive resin composition using such a polymer of a polyimide precursor. Further provided are a patterning process and a method of forming a cured film using the composition.n Provided is a polymer of a polyimide precursor which comprises a structural unit represented by the following general formula (1), nn n n n n n n n n n n n wherein, X 1 , R 1 , Z, a repeating number “s”, Y 1 , Rf, a repeating number “n” and “k” represent the same meanings as mentioned in the specification. |