http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018012890-A1

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filingDate 2015-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6038362c6ecc7d2516ba4ff79ce0d290
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publicationDate 2018-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018012890-A1
titleOfInvention Semiconductor device and manufacturing method thereof
abstract A manufacturing method of a semiconductor device, comprising the following steps: providing a semiconductor substrate comprising a low-voltage device region and a high-voltage device region; forming first gate oxide layers in a non-gate region of the high-voltage device region and the low-voltage device region and a second gate oxide layer in a gate region of the high-voltage device region; the thickness of the second gate oxide layer is greater than the thickness of the first gate oxide layer; forming a first polysilicon gate and a first sidewall structure on the surface of the first gate oxide layer of the low-voltage device region and a second polysilicon gate and a second sidewall structure on the surface of the second gate oxide layer; the width of the second gate oxide layer is greater than the width of the second polysilicon gate; performing source drain ions injection to form a source drain extraction region; after depositing a metal silicide area block (SAB), performing a photolithographic etching on the metal SAB and forming metal silicide. The above manufacturing method of a semiconductor device simplifies process steps and reduces process cost. The present invention also relates to a semiconductor device.
priorityDate 2015-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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