| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76251 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-566
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dea9221c32483b628fb29d23ce414294
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74addc67857f38a714d4375c814fb737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_217d5b464ee128c1d2c67dea2fa63fa8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e2175c9219bbc793c8dde3f525f64c3 |
| publicationDate |
2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017062569-A1 |
| titleOfInvention |
Surface encapsulation for wafer bonding |
| abstract |
Techniques are disclosed for wafer bonding with an encapsulation layer. A first semiconductor substrate is provided. An encapsulation layer is then formed on top of the first semiconductor substrate. The encapsulation layer is formed of an encapsulation material that creates a stable oxide when exposed to an oxidizing agent. A first bonding layer is formed on top of the encapsulation layer. Next, a second semiconductor substrate is provided. A second bonding layer is formed on top of the second bonding layer. Thereafter, the first semiconductor substrate is bonded to the second semiconductor substrate by attaching the first bonding layer to the second bonding layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018151535-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10121762-B2 |
| priorityDate |
2014-06-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |