| abstract |
A 3D printed polishing pad for chemical-mechanical planarization (CMP) comprises a microlattice including a plurality of layers of extruded filaments arranged in a crisscross pattern. The extruded filaments comprise a polymer composite including a thermoset polymer matrix and filler particles dispersed therein, where the filler particles comprise a length or diameter of no greater than about 200 nm. A three-dimensional network of interconnected voids extends through the microlattice. |