| abstract |
Provided is a curable resin composition which: has high levels of dielectric characteristics required in an electrically insulating material application compatible with a high frequency; provides a cured article excellent in low water absorption rate and low linear expansion rate; and is excellent in wire embedding flatness and resin fluidity. Specifically, provided is an aromatic polyester obtained by condensing (a) an aromatic oxycarboxylic acid, (b) an aromatic polyvalent carboxylic acid or an aromatic polyhydric hydroxy compound, and (c) an aromatic monohydroxy compound or an aromatic monocarboxylic acid. Also provided is a curable resin composition containing the aromatic polyester (A), an epoxy resin (D) having two or more epoxy groups per molecule, and a curing accelerator (E). |