| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-16 |
| filingDate |
1999-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c614ad9ac094920aba30b50298950dbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f8169fa88353997d70b46f1648b7474 |
| publicationDate |
2001-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001011296-A |
| titleOfInvention |
Thermosetting resin composition, insulating material for build-up method, and build-up printed wiring board |
| abstract |
(57) [Summary] A thermosetting resin composition whose cured product is excellent in low water absorption without impairing conventional heat resistance and low dielectric property, and for a build-up method using the same. To provide insulation materials and build-up printed wiring boards. A thermosetting resin and the following structural unit (I) , A thermosetting resin composition containing an aromatic polyester containing 90 mol% or more of the above, an insulating material for a build-up method using the same, and a build-up printed wiring board. Embedded image |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8784638-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013037513-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015376447-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016183308-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103857722-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008142541-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008142541-A2 |
| priorityDate |
1999-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |