http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015129897-A1

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publicationDate 2015-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015129897-A1
titleOfInvention Pretreatment Method for Reduction and/or Elimination of Basal Plane Dislocations Close to Epilayer/Substrate Interface in Growth of SiC Epitaxial Films
abstract Non-destructive pretreatment methods are generally provided for a surface of a SiC substrate with substantially no degradation of surface morphology thereon. In one particular embodiment, a molten mixture (e.g., including KOH and a buffering agent) is applied directly onto the surface of the SiC substrate to form a treated surface thereon. An epitaxial film (e.g., SiC) can then be grown on the treated surface to achieve very high (e.g., up to and including 100%) BPD to TED conversion rate close to the epilayer/substrate interface.
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