http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014374934-A1

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filingDate 2013-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2014374934-A1
titleOfInvention Method for strengthening semiconductor manufacturing tools
abstract A method for strengthening semiconductor manufacturing tools is provided. The method includes providing a mold insert, forming a native oxide layer, attaching a release agent film, and forming a glass bonded SiO x release agent layer. With the method, a firm glass bonded SiO x release agent layer is formed uniformly on the surface of the mold insert to make the mold insert of semiconductor manufacturing tools much more resistant to abrasion and durable, extend the service life of the mold insert, cut production costs of semiconductor manufacturing, enable easy release of the mold insert, and speed up semiconductor manufacturing. Furthermore, the uniformity of the glass bonded SiO x release agent layer on the surface of the mold insert helps promote the yield when making sub-molds by the mold insert.
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