| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c1e49aee5e8b4d0893942406354c171 |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73267
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-19 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b151b58d57e551c8f6e8da42a8336392
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_591bfe9f2c12cd53003e6634203e6ef1 |
| publicationDate |
2014-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2014027929-A1 |
| titleOfInvention |
Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP |
| abstract |
A semiconductor device includes a semiconductor die. An encapsulant is deposited over the semiconductor die. A conductive micro via array is formed outside a footprint of the semiconductor die and over the semiconductor die and encapsulant. A first through-mold-hole (TMH) is formed including a step-through-hole structure through the encapsulant to expose the conductive micro via array. An insulating layer is formed over the semiconductor die and the encapsulant. A micro via array is formed through the insulating layer and outside the footprint of the semiconductor die. A conductive layer is formed over the insulating layer. A conductive ring is formed comprising the conductive micro via array. A second TMH is formed partially through the encapsulant to a recessed surface of the encapsulant. A third TMH is formed through the encapsulant and extending from the recessed surface of the encapsulant to the conductive micro via array. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014353711-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015262909-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10818536-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11043410-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11610855-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9831219-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10629476-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021098384-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016203538-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10566229-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020243461-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017317041-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10249585-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9082780-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11114315-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018300800-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9916999-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11532564-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11233028-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9735134-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020111717-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11232957-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10026646-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11574849-B2 |
| priorityDate |
2011-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |