| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52 |
| filingDate |
2012-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af51ab71bb008fdd9e5fe4851c118eff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_535b1a66b339dbc1d708a7d300600882 |
| publicationDate |
2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013164869-A1 |
| titleOfInvention |
Producing method of light emitting diode device |
| abstract |
A method for producing a light emitting diode device includes the steps of preparing a board mounted with a light emitting diode; preparing a hemispherical lens molding die; preparing a light emitting diode encapsulating material which includes a light emitting diode encapsulating layer and a phosphor layer laminated thereon, and in which both layers are prepared from a resin before final curing; and disposing the light emitting diode encapsulating material between the board and the lens molding die so that the phosphor layer is opposed to the lens molding die to be compressively molded, so that the light emitting diode is directly encapsulated by the hemispherical light emitting diode encapsulating layer and the phosphor layer is disposed on the hemispherical surface thereof. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016060073-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9070845-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10883045-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9356207-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11506978-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9455387-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015333044-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106252474-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014306242-A1 |
| priorityDate |
2011-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |