| abstract |
Provided are a resin composition capable of forming a cured film excellent in elongation properties; a polymer suitable as a component contained in the composition; a cured film formed from the composition; and an electronic part including the cured film. The resin composition includes (A) a polymer containing a structural unit represented by the formula (a1) and a structural unit represented by the formula (a2); and (F) a solvent, n n n n n n n n n n n n wherein in the formula (a1), R 1 s are each independently a hydrogen atom or hydroxyl group, provided that at least one R 1 is hydroxyl group; and R 2 is a hydrogen atom or a C1-4 alkyl group; and in the formula (a2), R 3 s are each independently a group having a cationic polymerizable group, or a hydrogen atom, provided that at least one R 3 is a group having a cationic polymerizable group; and R 4 is a hydrogen atom or a C1-4 alkyl group. |