| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8c5aeec89642080f8ca5b57e205ac83f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_42188412d11a11a6ff7c07b39b899b70 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate |
2011-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_741bdac49871fe22758c79fb5e70d8cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b728f1e004b14950b67a996c6261796 |
| publicationDate |
2013-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013005149-A1 |
| titleOfInvention |
Chemical-mechanical planarization of substrates containing copper, ruthenium, and tantalum layers |
| abstract |
A chemical-mechanical polishing composition comprising: (a) at least one type of abrasive particles; (b) at least two oxidizing agents; (c) at least one pH adjusting agent; and (d) deionized water; (e) optionally comprising at least one antioxidant, and a method for the chemical-mechanical planarization of a substrate containing at least one copper layer, at least one ruthenium layer, and at least one tantalum layer comprising the steps of (1) providing the said chemical-mechanical polishing composition; (2) contacting the substrate surface to be polished with the chemical-mechanical polishing composition and a polishing pad; and (3) chemically and mechanically polishing the substrate surface by way of moving the polishing pad relative to the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11525072-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9070632-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11725117-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160013814-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9263296-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020120641-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020120522-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019119523-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10920105-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015368515-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102371843-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020120520-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9299585-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014187043-A1 |
| priorityDate |
2010-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |