| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_95697ea3e2566251b0d84ffcfd2dc167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bbcbd8a5fb95da385d9f3d255fe70aa5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4283a2f8ade5dc582d75300427a38e50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_957fd732e4825bc6bb7ca62d2f8d40f0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-70 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2010-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10732e7e381ebde3bf3004ded166e49e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9275944c5b6293b00113ce7ff5f778e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02a84bb2449e534e37e936c2abb13c36 |
| publicationDate |
2012-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012308831-A1 |
| titleOfInvention |
Epoxy resin composition |
| abstract |
A low temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having per molecule at least two epoxy groups and that is liquid at 25° C.; an aromatic amine based curing agent that contains an aromatic amine compound having per molecule at least two amino groups directly bonded to the aromatic ring and that is liquid at 25° C.; and Mg(II) acetylacetonate as a cure accelerator. The composition, which contains a novel cure accelerator using a metal complex, exhibits high stability at room temperature while lowering a cure temperature or shortening a cure time. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111742384-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017247502-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019259549-A1 |
| priorityDate |
2009-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |