| abstract |
To provide a mold release film for producing a light emitting diode by a mold, which is less susceptible to formation of pin holes or rupture and which is applicable to mass production of a light emitting diode by means of a mold having a plurality of cavities, and a process for producing a light emitting diode by means of such a mold release film. A mold release film to be disposed on the cavity surface of a mold to form a substantially hemispherical lens portion by encapsulating a light emitting element of a light emitting diode with an encapsulation resin, which release film has a thickness of from 16 to 175 μm and a tensile rupture elongation of from 600 to 3,000% at 110° C. as measured in accordance with JIS K7127, and a process for producing a light emitting diode by means of such a mold release film. |