| abstract |
When sealing a semiconductor element with a curable resin, a release film is excellent in releasability, can suppress contamination of the resin-encapsulated portion or the mold by the release film, and can also form a resin-encapsulated portion having excellent adhesion to the ink layer, and Provision of a method for manufacturing a semiconductor package using the release film. A method for manufacturing a semiconductor package in which a semiconductor element is placed in a mold and sealed with a curable resin to form a resin encapsulation, comprising: a release film disposed on a cavity surface of a mold, wherein the material is in contact with the curable resin when the resin encapsulation is formed. It has one surface and a second surface in contact with the cavity surface, at least the first surface is made of a fluororesin, and F/Al in a specific test method is 0.2 to 4 or F/(C + F + O ) Is 0.1 to 0.3. |