| abstract |
An electroless gold plating solution with which one or more openings formed in a resist overlying a substrate can be filled in a short time, the openings having a width on the order of micrometer, in particular, 100 μm or smaller, in terms of the width of the exposed substrate area, and having a height of 3 μm or larger. The electroless gold plating solution contains a deposition accelerator for deposition in fine areas, and a microfine pattern of 100 μm or finer is formed therefrom. |