| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c8401bd1a86a10d5508942a53475fc38 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-24 |
| filingDate |
2018-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0062324127cbea9311073c7d8a902f4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9858f9a285a68fc1f921660d883b159e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6b29e89c2322d4d55ae30941311e37b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d0ebc12e61d6392ebe8a374646e0f95 |
| publicationDate |
2022-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11512394-B2 |
| titleOfInvention |
Electroless gold plating bath |
| abstract |
The present invention concerns an electroless gold plating bath comprisinga) gold ions;b) sulfite ions;c) iodide ions;d) at least one phosphonate compound according to formula (1)whereineach X is independently an alkanediyl group;R1, R2, R3 and each R4 are independently alkanediyl groups;M is independently hydrogen, a metal atom or a cation forming radical;each n is a rational number and selected in accordance with the valency of the respective M; andb is an integer ranging from 1 to 10.The invention further is directed to the use of the bath and a method for depositing a gold layer on a surface of a substrate. The bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like. |
| priorityDate |
2018-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |