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publicationDate	2012-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2012043654-A1
titleOfInvention	Mechanisms for forming copper pillar bumps using patterned anodes
abstract	The mechanisms of preparing bump structures described by using patterned anodes may simplify bump-making process, reduce manufacturing cost, and improve thickness uniformity within die and across the wafer. In addition, the mechanisms described above allow forming bumps with different heights to allow bumps to be integrated with elements on a substrate with different heights. Bumps with different heights expand the application of copper post bumps to enable further chip integration.
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