| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c85d78c6a4459b5dbbc49c82a4c5c107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D303-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D233-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 |
| filingDate |
2016-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5669523963c2a42717461034a12d15b8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e585392b39a89b3d1ec46ece0ea04e6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9615f3350e08850291cbc17b4aa94454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded681fae2f2f527546f22245684b484
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ee156d9e33f10e88d9ec4a5d6f42f0e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5dfd7591ee4337f4e65d35395178b6f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_169ba7bc48c213fabf3aff835bed6d41 |
| publicationDate |
2017-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-3128044-A1 |
| titleOfInvention |
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| abstract |
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3225719-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3263745-A1 |
| priorityDate |
2015-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |