| abstract |
An electronic structure may include a conductive pad on a substrate, and an insulating layer on the substrate and on the conductive pad. The insulating layer may have a via therein so that a portion of the conductive pad opposite the substrate is free of the insulating layer. A conductive layer comprising copper may be on the portion of the conductive pad free of the insulating layer, on sidewalls of the via, and on surface portions of the insulating layer surrounding the via opposite the substrate and the conductive pad, and the conductive layer comprising copper may have a thickness of at least approximately 1.0 μm. A conductive barrier layer may be on the conductive layer comprising copper, and the conductive barrier layer may include at least one of nickel, platinum, palladium, and/or combinations thereof. A solder layer may be on the conductive barrier layer, the conductive layer comprising copper and the solder layer may comprise different materials, and the conductive barrier layer may be between the conductive layer comprising copper and the solder layer. |