| abstract |
A microelectronic mechanical structure (MEMS) comprising a semiconductor chip having an integrated circuit including a plurality of micromechanical components, and a plurality of conductive routing lines integral with the chip; the routing lines having contact terminals of oxide-free metal; and the terminals having a layer of barrier metal on the oxide-free metal and an outermost layer of noble metal, whereby damage-free testing of the circuit is possible using test probe needles. n The barrier metal is selected from a group consisting of nickel, cobalt, chromium, molybdenum, titanium, tungsten, tantalum, palladium, platinum, rhodium, rhenium, osmium, vanadium, iron, ruthenium, niobium, iridium, zirconium, hafnium, copper, and alloys thereof. Alloys of these metals may contain phosphorus or boron. n The outermost layer is a noble metal which is bondable or solderable, and is selected from a group consisting of gold, platinum, palladium, silver, rhodium, and copper. Alloys of these metals may contain phosphorus or boron. |