| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2748ce90b744bc87f0f6fdb29e903324 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28 |
| filingDate |
2010-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c7aa7fb6c9df58595ca96fba975f6fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a77944237c165ba11f82052fbdedbe7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29e05ae102dec3ef312e2ffb56dbea13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_641ffc0cc5da0fbbfdefeb07a4685f5a |
| publicationDate |
2011-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2011070814-A1 |
| titleOfInvention |
Method for Manufacturing Polishing Pad and Polishing Pad |
| abstract |
The present invention relates to a method for manufacturing a polishing pad. The method of the invention includes the steps of forming a polishing layer from a polyurethane solution has a solid content more than about 90 wt % and drying the polyurethane solution at a temperature from about 130° C. to about 170° C. The invention also provides a polishing pad manufactured by the method mentioned above. The defect of scraping the surface of the substrate to be polished due to polishing particles remaining is avoided when applying the polishing pad according to the invention, and the flatness of the substrate to be polished is raised and the defective rate is eliminated also. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11130211-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103128677-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017355064-A1 |
| priorityDate |
2009-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |