| abstract |
Method for producing a metal-containing film by introducing a metal source which does not contain metal-C or metal-N—C s-bonds (for example, TaCl<SUB>5</SUB>, SEt<SUB>2</SUB>), a silicon precursor (for example, SiH(NMe<SUB>2</SUB>)<SUB>3</SUB> or (SiH<SUB>3</SUB>)<SUB>3</SUB>N), a nitrogen precursor such as ammonia, a carbon source such as monomethylamine or ethylene and a reducing agent (for example, H<SUB>2</SUB>) into a CVD chamber and reacting same at the surface of a substrate to produce metal containing films in a single step. |