| abstract |
Described are heat hardening compounds which contain at least one epoxy resin, A, with on average more than one epoxy group per molecule, at least one impact-strength modifier, B, at least one crack promoter, C, as well as at least one hardener, D, for epoxy resin, which is activated by raised temperature. Silicate layers such as mica or talc and graphite are particularly suitable as crack promoters, C. |