| abstract |
A curable resin composition of the present invention has a compound having two or more blocked isocyanate groups where the isocyanate group is blocked by a blocking agent and the dissociation temperature between the isocyanate group and the blocking agent is 140° C. or less, or a compound having two or more free isocyanate groups, and a nylon salt (I), (II) or (III), which has a specific chemical structure, and it has extremely excellent storage stability and low-temperature curing property which are compatible with each other. Also, a curable resin composition which is obtained by allowing the above composition to contain an epoxy compound is provided, so that excellent weatherability is obtained in addition to the storage stability and the low-temperature curing property. |