| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4661 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| filingDate |
2008-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76a5fe3304e5f90cfa2b2bde76c58f28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e35a46f85b3e2b946ac3edf1cabaa65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7228c530f8ee513e08c2670f18b00e6 |
| publicationDate |
2009-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009314532-A1 |
| titleOfInvention |
Thermosetting resin composition, dry film including thermosetting resin composition, and multilayer printed wiring board including thermosetting resin composition |
| abstract |
A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10253223-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9796810-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016056123-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10645804-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11252824-B2 |
| priorityDate |
2008-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |