| abstract |
The disclosure relates to porous silicon/conductive polymer composites that can be used in biosensor applications (e.g., in a binding assay that captures a target analyte). The composite material generally includes (a) a p-doped silicon substrate that has a porous surface; (b) a lawn of a conductive polymer bound to the porous surface; and (c) a binding pair member bound to the conductive polymer. The porous silicon surface provides excellent adhesion between the substrate and the conductive polymer, thereby eliminating the need for an intervening metallic layer. Processes according to the disclosure for forming the composite material generally include electropolymerizing and electrodepositing the conductive polymer onto the porous surface of the silicon substrate and then binding the binding pair member to the conductive polymer. Methods and kits employing the composite materials are also disclosed. |