| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a95ad551d9d510416a4d10faf8e392ac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f3e9cf7387c5d7c2f45d8efa8ac55523 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate |
2007-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e159ae9231247049155a6716e0883fe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5e47725804fda77ef393913abbea943 |
| publicationDate |
2009-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009036344-A1 |
| titleOfInvention |
Reduced metal etch rates using stripper solutions containing metal salts |
| abstract |
Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper or cobalt salt with or without an added amine to improve solubility of the copper or cobalt salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10948826-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11460778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11353794-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10072237-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9012387-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3537474-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110244526-A |
| priorityDate |
2007-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |