| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B55-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65H1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 |
| filingDate |
2007-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83622f1096bdf9f178e7aa318f9fe43b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e5a8be15b5ae5216a0b3bbe76ef7a21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c446014ba7b3bad9bdebe1df6afaee0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e66d8aa36a64aac375b850134e02d01 |
| publicationDate |
2008-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008299878-A1 |
| titleOfInvention |
Systems and methods for reducing electrostatic charge of semiconductor wafers |
| abstract |
A chemical-mechanical polishing machine and associated methods are disclosed. One embodiment of the machine includes a polishing pad, a wafer carrier corresponding to the polishing pad and configured to carry a semiconductor wafer, and a transfer station proximate to the polishing pad for holding the wafer during loading and/or unloading. At least one of the wafer carrier and the transfer station is configured to dissipate electrostatic charge from the wafer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8004782-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10131134-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I723058-B |
| priorityDate |
2007-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |