| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_63977f37b3e6c5d13502d7590dd16e07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b8872f69c25be5c14f9f75593be437b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_42f571b0d5bf1ac0062565170b1ce9f6 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 |
| filingDate |
2007-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0c7b9c23a8034b6337189c2814809e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40899d1f6de0ee53e90fc209cafa1061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_146bca46910f381dcc1385dae8924c6f |
| publicationDate |
2008-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008286965-A1 |
| titleOfInvention |
Novel approach for reducing copper line resistivity |
| abstract |
A method for fabricating an integrated circuit structure and the resulting integrated circuit structure are provided. The method includes forming a low-k dielectric layer; form an opening in the low-k dielectric layer; forming a barrier layer covering a bottom and sidewalls of the low-k dielectric layer; performing a treatment to the barrier layer in an environment comprising a treatment gas; and filling the opening with a conductive material, wherein the conductive material is on the barrier layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021050316-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015017799-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10157866-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10134856-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7919862-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8759975-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017271287-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7956465-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10811374-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11728296-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011171826-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11183424-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9842767-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007257369-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8426307-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11164780-B2 |
| priorityDate |
2007-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |