| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1632
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1619 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C11-11 |
| filingDate |
2007-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c24579bfc7ccac52b15c48b8fa6eb0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8430cc59c5c83ff3d31015db78309049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_659422517d8178b3cbe1b8a7cc2c8b21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69e4d9ea3d3175f049246c9c5739c215
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db466ffae5dddd0bbdec6df8b3f1863f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa847e003c6d6b094198ce77cf791960
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb32e01f1afe2bbd36c3cb19a34bb85d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d638c8516c97b9c5de78bdedaea97ae3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8d787a1a28d9c496ac5be4e7d1be62d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cceb5b151eaa5eb966d4e3a0fb562c67 |
| publicationDate |
2008-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008254621-A1 |
| titleOfInvention |
Wafer Electroless Plating System and Associated Methods |
| abstract |
A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101789841-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102741972-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011072268-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011143553-A1 |
| priorityDate |
2007-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |