| abstract |
A plasma processing apparatus 100 includes an upper plate 60 and a lower plate 61 disposed above a susceptor 2 . The upper plate 60 and lower plate 61 are made of a heat resistant and insulative material, such as quartz. The two plates are disposed in parallel with each other with a predetermined gap of, e.g., 5 mm interposed therebetween. The two plates have a plurality of through holes 60 a and 61 a formed therein and positionally shifted from each other. The two plates are disposed in an overlapped state such that the through holes 61 a of the lower plate 61 are not aligned with the through holes 60 a of the upper plate 60. |