| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d437b2abb428aeb59000da0b15dc2f98 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K31-02 |
| filingDate |
2007-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46936c1874ac36c02b6d54f129faf409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56a833fe45e956befc481a978aacb7de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45231c64fe93c8701e4e731a814dda16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7be437e0f599444fbd774dbd13a41bf6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3dc9e44eb667fe4653dfbfc897b7cf6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_668b0b7cc91065871eb6e70ef35977cc |
| publicationDate |
2007-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007241170-A1 |
| titleOfInvention |
Flux for soldering and circuit board |
| abstract |
A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8070047-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8070044-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8070043-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8070046-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8070045-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8434666-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8434667-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8430293-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8430295-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8430294-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102029488-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7208579-B1 |
| priorityDate |
2004-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |