http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7208579-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate | 2022-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2023-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2023-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-7208579-B1 |
| titleOfInvention | flux and solder paste |
| abstract | The present invention provides a flux capable of further suppressing changes in the viscosity of solder paste over time, and a solder paste using this flux. The present invention provides a flux containing a rosin, a solvent, a thixotropic agent, a thiol compound, and an activator, wherein the thiol compound converts one or more hydrogen atoms on a benzene ring to a mercapto group. It is characterized by containing a compound (Tp) having a benzenethiol skeleton substituted with (-SH). This compound (Tp) is preferably at least one thiol compound selected from the group consisting of 2-aminobenzenethiol, 4-aminobenzenethiol, 3-aminobenzenethiol and benzenethiol. [Selection figure] None |
| priorityDate | 2022-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 390.